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128 Lead Tqfp 15 Mil Ultra Fine Pitch

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  • Cebu Chip Connections Incorporated

    Featured products home product capabilities certifications information request contact us ccc bonding wire copyright 2009 all rights reserved

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  • Manncorp Installs Smt Assembly Line In

    Manncorp installs smt assembly line in guadalajara manncorp a usbased supplier of pcb assembly equipment has installed an smt assembly 128 slots each and the ability to place a wide range of smds from 01005 chip components to bgas and 15 mil ultrafinepit

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  • Pd3068 Package Mechanical Drawings Datasheet

    5193068 620 719 microsemi headquarters one enterprise aliso viejo ca 92656 usa within the usa 1 800 7134113 outside the usa 1 949 3806100

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  • 128 Kbit Serial Ic Bus Eeprom Farnell Element14

    November 2011 doc id 16892 rev 20 138 1 m24128bw m24128br m24128bf 128 kbit serial ic bus eeprom features supports the i2c bus modes 400 khz fastmode 100 khz standardmode

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  • Highdensity Design With Microstar Bgas Ticom

    Highdensity design with microstar bgas 3 13 via density via density as mentioned previously can be a limiting factor when designing a highdensity board via density is defined as the number of vias in a particular board area using smaller vias increases th

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  • Packaging Terminology Ticom

    Ti defines leadfree pbfree or pbfree to mean semiconductor products that are compatible with the current rohs requirements for all six substances including the requirement that lead not exceed 01 by weight in homogeneous materials

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  • Ufdfpn8 Footprint Datasheet Applicatoin Notes

    Ufdfpn8 8lead ultra thin fine pitch dual flat package no lead 2 x 3 mm outline e d b l1 l3 original m24c04 m24c02 m24c01 figure 15 ufdfpn8 mlp8 8lead ultra thin fine pitch dual flat package no position of pin 1 table 21 tssop8 dw 169 mil width pdip8 bn

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  • Qfplqfptqfp Lsi Package Lapis Semiconductor

    Lapis semiconductor excels in a number of technologies including low power consumption digitalanalog mixed signals highfrequency circuits and memory design and provides logic lsis memory lsis display driver lsis and foundry services

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  • Cebu Chip Connections Incorporated

    Featured products home product capabilities certifications information request contact us ccc bonding wire copyright 2009 all rights reserved

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  • Semiconductor Package Families Pcb Heaven

    Semiconductor package families author giorgos lazaridis february 23 2009 ultra thin dual flat nolead plastic package utdfn 6 lead ultra thin dual flat nolead plastic package utdfn col thin fine pitch plastic ball grid array package tfbga 81 ball thin fi

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  • 128kbit Serial Ic Bus Eeprom 4donlineihscom

    Description m24128bw m24128br m24128bf m24128df 640 docid16892 rev 23 1 description the m24128 is a 128kbit i2ccompatible eeprom electrically erasable

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  • Manncorp Installs Smt Assembly Line In

    Manncorp installs smt assembly line in guadalajara manncorp a usbased supplier of pcb assembly equipment has installed an smt assembly 128 slots each and the ability to place a wide range of smds from 01005 chip components to bgas and 15 mil ultrafinepit

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  • Ultra Performance End Mills Supermill Llc

    Ultraperformance end mills supermill llc looking for maximum productivity while machining a variety of materials supermill can help we manufacture a variety of ultraperformance allpurpose and highperformance end mills primarily made of carbide

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  • 48pin Datasheet Applicatoin Notes Datasheet Archive

    48pin datasheet cross reference 10 12 10 12 14 75 10 12 10 12 14 package leadfree 44 pin tqfp leadfree 48pin tqfp leadfree 44 pin tqfp leadfree 48pin tqfp leadfree 44 pin tqfp leadfree 48pin tqfp lead all devices are offered in 48pin tsop and 48ball fi

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  • M24512w M24512r M24512df Static6arrowcom

    Description m24512w m24512r m24512df 647 ds6520 rev 30 1 description the m24512 is a 512kbit i 2 ccompatible eeprom electri cally erasable programmable memory organized as 64 k 8 bits the m24512w can operate with a supply voltage from 25 v to 55 v the m2

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  • Packaging Specifications Microchip Technology

    Options include small outline packages such as wafer level chipscale csp ultradual flat no lead udfn ultraquad flat no lead uqfn plastic shrink small outline ssop plastic think shrink small outline tssop plastic small outline soic thin quad flat pack tqfp

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  • Atxmega128a1 Atxmega64a1 Preliminary

    Atxmega64a1c7u 64k 4k 2 kb 4 kb atxmega64a1c7ur package type 100a 100lead 14 x 14 x 10mm 05mm lead pitch thin profile plastic quad flat package tqfp 100c1 100ball 9 x 9 x 12mm body ball pitch 088mm chip ball grid array cbga 100c2 100ball 7 x 7 x 10mm bod

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  • Surfacemount Technology Wikipedia

    Surfacemount technology smt is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards pcbs an electronic device so made is called a surfacemount device smdin industry it

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  • Qfplqfptqfp Lsi Package Lapis Semiconductor

    Lapis semiconductor excels in a number of technologies including low power consumption digitalanalog mixed signals highfrequency circuits and memory design and provides logic lsis memory lsis display driver lsis and foundry services

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  • Leadfree And Halogenfree Packaging From Lattice

    Flat pack pqfp fine pitch bga fpbga fine pitch thin bga ftbga chip array bga cabga chip scale bga csbga ultra chip scale bga ucbga flip chip bga fcbga quad flatpack no lead sawsingulated qfns and wafer level chip scale packaging wlcsp to better facilitate

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